FLIP CHIP BONDER: i-Cube10
Realize mixed mounting of semiconductor and SMD
Features of YSH20
- 4,500 UPH (0.8 sec/unit); the top mounting capability in semiconductor manufacturing flip chip bonding
- +/- 10 µm (3σ) mounting accuracy
- YWF wafer supply unit “6/8/12 inch”, “expand ring”, and “θ angle correction” applicable
- 0.6 × 0.6 mm to 18 × 18 mm components applicable
Specifications
| Modell | YSH20 |
|---|---|
| Applicable PCB | L 50 x W 30 mm to L 250 x W 200 mm ** “Up to L 340 x W 340 mm” is applicable. Please contact us separately. |
|
[2F2F heads & multi-camera type]Repeatability (3): +/- 0.010 mm/unit +/- 0.05 degree [4M4M heads & multi-camera type] ** under development Repeatability (3): +/- 0.010 mm/unit +/- 0.05 degree |
|
[2F2F heads & multi-camera type] 4,500 UPH (0.8 sec/unit) ** excluding dipping 3,600 UPH (1.0 sec/unit) ** including dipping [4M4M heads & multi-camera type] ** under development 5,500 UPH (0.65 sec/unit) ** excluding dipping 4,500 UPH (0.8 sec/unit) ** including dipping |
| Component supply configuration | Wafer (6/8/12 inch flat ring), waffle tray, tape reel (8/12/16 mm width) |
| Geeignete Bauteile | [multi-camera] flipchip: 0.6 x 0.6 mm to 18 x 18 mm bump diameter 60 μm or more bump pitch 110 μm or more, H 0.7 mm or less SMD Chip: 0402 (metric base) to 20 x 20 mm, H 6mm or less |
| Spannungsversorgung | 3-phase AC 200/208/220/240/380/400/416V +/- 10% 50/60Hz |
| Druckluftversorgung | 0.5 MPa or more, in clean, dry state |
| External dimension ** excluding projections |
L 1,400 x W 1,820 x H 1,515 mm (main unit only) L 1,400 x W 2,035 x H 1,515 mm (when YWF wafer supply unit is installed) |
| Gewicht | Approx. 2,470 kg (main unit only) Approx. 2,780 kg (when YWF wafer supply unit is installed) |
Die Spezifikationen und das Erscheinungsbild können ohne vorherige Ankündigung geändert werden.
Diese Informationen können wir Ihnen derzeit nur in englischer Sprache zur Verfügung stellen.