YSB55w

YSB55w

FLIP CHIP BONDER: YSB55w Back to flip chip bonder overview  → The YSB55w from Yamaha is a high-speed & high-accuracy flip chip bonder unit. It offers a high bonding accuracy and 3 times the productivity of conventional machines! The YSB55w brings a new...
YSH20

YSH20

FLIP CHIP BONDER: YSH20 Back to flip chip bonder overview  → High-speed, high-precision flip chip hybrid placer for semiconductor back-end industry. YSH20 is a hybrid surface mounter, specially designed to mount printed circuit boards with flip chips that...