FLIP CHIP BONDER: YSH20
High-speed, high-precision flip chip hybrid placer for semiconductor back-end industry. YSH20 is a hybrid surface mounter, specially designed to mount printed circuit boards with flip chips that are used in increasing numbers today in IT communications devices and electric home appliances. Yamahas YSH20 features a high-rigidity frame and dual mount heads and is fitted with a chip recognition system employing a camera with high resolution performance. In addition to providing high levels of mounting accuracy and highest speed.
Features of YSH20
- 4,500 UPH (0.8 sec/unit); the top mounting capability in semiconductor manufacturing flip chip bonding
- +/- 10 µm (3σ) mounting accuracy
- YWF wafer supply unit “6/8/12 inch”, “expand ring”, and “θ angle correction” applicable
- 0.6 × 0.6 mm to 18 × 18 mm components applicable
Specifications
| Model | YSH20 |
|---|---|
| Applicable PCB | L 50 x W 30 mm to L 250 x W 200 mm ** “Up to L 340 x W 340 mm” is applicable. Please contact us separately. |
|
[2F2F heads & multi-camera type]Repeatability (3): +/- 0.010 mm/unit +/- 0.05 degree [4M4M heads & multi-camera type] ** under development Repeatability (3): +/- 0.010 mm/unit +/- 0.05 degree |
|
[2F2F heads & multi-camera type] 4,500 UPH (0.8 sec/unit) ** excluding dipping 3,600 UPH (1.0 sec/unit) ** including dipping [4M4M heads & multi-camera type] ** under development 5,500 UPH (0.65 sec/unit) ** excluding dipping 4,500 UPH (0.8 sec/unit) ** including dipping |
| Component supply configuration | Wafer (6/8/12 inch flat ring), waffle tray, tape reel (8/12/16 mm width) |
| Applicable components | [multi-camera] flipchip: 0.6 x 0.6 mm to 18 x 18 mm bump diameter 60 μm or more bump pitch 110 μm or more, H 0.7 mm or less SMD Chip: 0402 (metric base) to 20 x 20 mm, H 6mm or less |
| Power supply | 3-phase AC 200/208/220/240/380/400/416V +/- 10% 50/60Hz |
| Air supply source | 0.5 MPa or more, in clean, dry state |
| External dimension ** excluding projections |
L 1,400 x W 1,820 x H 1,515 mm (main unit only) L 1,400 x W 2,035 x H 1,515 mm (when YWF wafer supply unit is installed) |
| Weight | Approx. 2,470 kg (main unit only) Approx. 2,780 kg (when YWF wafer supply unit is installed) |
Specifications and appearance are subject to change without prior notice.