INSPECTION SOLUTIONS: YSi-SP
The SMT YSi-SP high-speed 3D Solder Paste Inspection machine is the long-awaited SPI from Yamaha: the YSi-SP is a high-speed 3D solder paste inspection machine that enables high-speed, high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections.
Features of YSi-SP
- SPI with “1-head solution” to perform various inspections with a single head
- Top test equipment that achieves high-accuracy high-speed inspections using 3D + 2D inspection, image resolution switch-over and more
- A thorough and extensive machine-to-machine (M2M) solution
- Statistical Process Control (SPC) for diverse statistical processing
- Optional features to enable handling various products
|Applicable PCB||L 510 x W 460 mm to L 50 x W 50 mm (single lane spec)|
|*No dual lane specification available.|
|Horizontal resolution (FOV size)||1）25 µm / 12.5 µm (approx. 50 x 50 mm)
2）20 µm / 10 µm (approx. 40 x 40 mm)
3）15 µm / 7.5 µm (approx. 30 x 30 mm)
*All are standard selection type.
|Height resolution||1 µm|
||Solder paste printing quality (volume, height, area and misalignment)|
||Single-phase AC 200 V–230 V ±10 %|
||L 904 x W 1,080 x H 1,478 mm|
||Approx. 550 kg|
Specifications and appearance are subject to change without prior notice.