The SMT YSi-SP high-speed 3D Solder Paste Inspection machine is the long-awaited SPI from Yamaha: the YSi-SP is a high-speed 3D solder paste inspection machine that enables high-speed, high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections.

Features of YSi-SP

  • SPI with “1-head solution” to perform various inspections with a single head
  • Top test equipment that achieves high-accuracy high-speed inspections using 3D + 2D inspection, image resolution switch-over and more
  • A thorough and extensive machine-to-machine (M2M) solution
  • Statistical Process Control (SPC) for diverse statistical processing
  • Optional features to enable handling various products

Specifications

ModelYSi-SP
Applicable PCBL 510 x W 460 mm to L 50 x W 50 mm (single lane spec)
*No dual lane specification available.
Horizontal resolution (FOV size)1)25 µm / 12.5 µm (approx. 50 x 50 mm)
2)20 µm / 10 µm (approx. 40 x 40 mm)
3)15 µm / 7.5 µm (approx. 30 x 30 mm)
*All are standard selection type.
Height resolution1 µm
  • Inspection items
Solder paste printing quality (volume, height, area and misalignment)
  • Power supply
Single-phase AC 200 V–230 V ±10 %
  • Air supply source
Airless specification
  • External dimension
L 904 x W 1,080 x H 1,478 mm
  • Weight
Approx. 550 kg

Specifications and appearance are subject to change without prior notice.