Yamaha has invented the automated 3D X-ray and optical Hybrid Inspection System “YSi-X”. This is a multi-function 3D X-ray hybrid-type inspection system capable of complete in-line inspection of all facets of printed circuit boards. Thanks to a 3D X-ray inspection function through newly developed Yamaha-exclusive high-speed X-ray laminography imaging technology and multiple inspection functions utilizing optics and lasers, the YSi-X is achieving the highest level of 3D X-ray inspection speed in the industry at 3.3 sec/FOV and is lengthening the service life of the X-ray source and X-ray tubes.

Features of YSi-X

  • Ideal for 100% 3D X-ray inspection of onboard automotive products and many other items by 3D X-rays acquire layered of target
  • Switchable tube voltage: 130 KV (onboard vehicle use), 110 KV (household use), 70 KV (device use)
  • Select the type you need X-ray detector: type A (high resolution type), type B (long service life type), or type D (wide-angle high-speed type)
  • X-ray, optical, infrared, and laser height measurement as standard test equipment; hybrid and high reliability with multiple inspection modes


Model YSi-X
Applicable PCB Size L 560 × W 460 mm to L 100 × W 50 mm
Mounted components Upper edge 40 mm, lower edge 80 mm (40 mm during inline)
X-ray inspection
X-ray detector FOS flat panel system
High-speed type
Direct conversion panel method
Long service life type
Resolution 7 to 54 µm 18 to 54 µm
  • Maximum field of view
62 × 78 mm 52 × 45 mm
  • Inspection speed 2DX
4078.8 mm2/sec
(resolution 27 µm)
250.3 mm2/sec
(resolution 54 µm)
  • Inspection speed 3DX
    (5 projection × 3)
378.7 mm2/sec (resolution 19 µm) 60.5 mm2/sec (resolution 27 µm)
  • Inspection speed 3DX
    (9 projection × 3)
218.4mm2/sec (resolution 19 µm) 40.9mm2/sec (resolution 27 µm)
  • Inspection speed 3DX
    (180 projection × 1)
15.1 mm2/sec (resolution 19 µm) 3.7 mm2/sec (resolution 27 µm)
Method 3D sliced images through digital laminography (planar CT)
Optical inspection Inspection speed 0.4 sec/field of view
Resolution 19 µm
Lighting 3-step dome lighting, upper stage RGB & infrared, mid-stage RGB, lower stage RGB
Image capture system Digital color camera, telecentric lens
Laser inspection Resolution/Method 5 µm (height direction)/Triangulation distance measurement by laser spot light
  • X-ray leakage
Less than 0.2 µSv/h
  • External
L 1,720 × D 1,883 × H 1,705 mm (excluding protrusions)/Approx. 2,900 kg

Specifications and appearance are subject to change without prior notice.